Laser Pad Cutter
Features
Pad-part cutting technology that minimizes circuit damage
Dummy handling structure optimized for pad cutting
Improved durability and foreign substance prevention through the application of an articulated robot
Allows for size inspection and the detection of cell surface defects
Specification
Laser Type
DPSS Laser
Laser Wavelength
515 ㎚
Cutting Accuracy
± 50 ㎛
Inspection
Size, Dent, Foreign Substances
Key Features
Beam Power Monitoring l Fume Suction for Pollution Prevention
Auto Worktable Cleaning