ABF Via-Drilling
Features
Process the ABF layer on the board to form via holes of different shapes/sizes
Enables high speed and high quality via hole formation
Checking for missing holes after processing without a separate inspection procedure
Various via holes can be processed
Automated / single-acting configurable
Compact design
Specification
Laser Type
UV Laser
Laser Wavelength
355㎚
Accuracy
±12.5㎛(CPK≥1.33)
Main function
- Via holes of 10~2000㎛ can be formed
- Missing Hole inspection feature during processing
- High-speed processing capabilities with Scanner and AOD