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PRODUCTS

Semiconductor Equipment

Features

  • Visualizing and inspecting holes and glass interiors

  • Deep learning recognizes and classifies defects.

  • Real-time hole analysis with GPU processing

Specification

Sample

~510x515㎜

Hole Size

≥ø10㎛

Product thickness

≤1.8t

Accuracy

· Location : ≥±3㎛
· Measurement : ≥±3㎛
· Defects : ≥10㎛

Tact Time

≤18min (Grab + Inspection)

Inspection Items

Location, Size, Circularity, Defects

Key Features

· Top to Bottom hole simultaneous measurement
· Deep learning based defect classification
· Process status feedback

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