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PRODUCTS

Semiconductor Equipment

Glass Singulation

Glass Singulation
LIST

Features

  • Next-Generation Polymer Removal Solution for Enhanced Substrate Integrity

  • Innovative glass core processing technologies to improve yield and reliability

  • Advanced multi-layer simultaneous imaging technology for precise glass core evaluation

Specification

Laser Type

Ultra Short Pulse Laser

Accuracy

±10 um

Product size

≤510 x 515 ㎟

Product thickness (with Polymer)

≤3t

Key Features

Fp to Qp, QP to Unit

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