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제품소개

반도체장비

제품특징

  • Total Hole 2.5D Image 처리 기술

  • AI 딥러닝을 통한 자동 결함 분류 기술

  • Big Data 고속 병렬 처리 기술

제품사양

Sample

~510x515㎜

Hole Size

≥ø10㎛

Product thickness

≤1.8t

Accuracy

· Location : ≥±3㎛
· Measurement : ≥±3㎛
· Defects : ≥10㎛

Tact Time

≤18min (Grab + Inspection)

Inspection Items

Location, Size, Circularity, Defects

Key Features

· Top to Bottom hole simultaneous measurement
· Deep learning based defect classification
· Process status feedback

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