DI
产品特征
使用多波长LED进行电路形成和焊盘抗阻剂(Solder Resist)对应
位置匹配（叠层）符合 ±10 μm (CPK1.33) 标准
无尘室兼容性(Clean room compatibility)符合半导体工艺和 UL 标准
产品规格
Wavelength
365㎚, 380㎚, 395㎚, 405㎚
Power Source
Independent LED light sources with 4 wavelengths (individual output adjustable)
Min. Line/Spare/SRD
15㎛ / 15㎛ / 75㎛
Min.Pixel Size
8.88㎛
Work size
510㎚ x 515㎚
Main function
Multi-split exposure support, Auto Focus on board, Automation