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PRODUCTS

半导体设备

产品特征

  • TGV孔及玻璃内部可视化与检测技术

  • 基于AI深度学习的缺陷自动分类技术

  • 大数据高速并行处理技术

产品规格

Sample

~510x515㎜

Hole Size

≥ø10㎛

Product thickness

≤1.8t

Accuracy

· Location : ≥±3㎛
· Measurement : ≥±3㎛
· Defects : ≥10㎛

Tact Time

≤18min (Grab + Inspection)

Inspection Items

Location, Size, Circularity, Defects

Key Features

· Top to Bottom hole simultaneous measurement
· Deep learning based defect classification
· Process status feedback

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